To meet the increased cooling and power needs of the accelerated computing IT stack, Vertiv, a worldwide supplier of key digital infrastructure and continuity solutions, has unveiled a new range of high-density data center infrastructure solutions. By using pre-engineered infrastructure solutions, digitalized management, and end-to-end service, the new Vertiv 360AI solutions aim to expedite the adoption of AI and enable deployments that are up to two times quicker than those of standard infrastructure installations.
Workloads of all sizes involving AI may be efficiently powered and cooled with Vertiv 360AI. Power, cooling, enclosures, end-to-end lifecycle services, and digitalized management are among the options.
Vertiv 360AI solutions would reduce the chance of issues during installation and commissioning in the data center environment and eliminate design cycles, allowing clients to achieve quicker deployment. These solutions would also help reduce implementation costs and scope by allowing for flexibility and customization and, where feasible, by reusing or adapting existing cooling systems.
“Our objective at Vertiv is to set up our clients for effective AI integration,” said Brad Wilson, Vertiv’s Vice President of Technology. “Building out hyperscale green fields and retrofitting air-cooled edge and enterprise data centers are just two of the new challenges that data center professionals and systems integrators are attempting to solve with our Vertiv 360AI portfolio, which offers a simplified path for scalable AI infrastructure.”
Supporting Flexible Cooling Strategies
Vertiv 360AI provides solutions that span from full-scale AI data centers to edge inferencing and assistance for AI test pilots. Up to 100kW may be powered and cooled by a single Vertiv 360AI rack.
For Vertiv 360AI, there are four different types of flexible cooling strategies: liquid-to-air, liquid-to-liquid, liquid-to-liquid, and liquid-to-refrigerant. In addition, Vertiv 360AI offers prefabricated modular solutions, such as power, cooling, and IT modules, which can be integrated and expanded as building blocks to meet present and future infrastructure requirements.
Vertiv 360AI may additionally feature indoor split chillers to offer liquid cooling with refrigerant-based heat rejection for clients without chilled water available.
Rear door heat exchangers, coolant distribution units (CDUs) and direct-to-chip liquid cooling, high-capacity free-cooling chillers, and big capacity chilled water-based prefabricated modular data center systems are just a few of the cooling options that Vertiv provides for AI and HPC. Power solutions include lithium-ion battery-powered uninterruptible power supply (UPS), busbar, switchgear, and battery energy storage systems (BESS) for microgrid applications.
